HLD-9916AB epoxy potting compound

Epoxy Potting & Encapsulating Compound

Epoxy potting compound is a high-adhesion adhesive that is very widely used; Huilida epoxy potting compound is also extensively applied in the aviation and aerospace industries. Therefore, it was once called the "universal adhesive". Huilida epoxy potting compound features strong adhesion, high bond strength, low shrinkage of about 1% upon curing, good medium resistance, excellent electrical performance, convenient application, low toxicity, and is suitable for bonding various metallic and non-metallic materials. It bonds both homogeneous and dissimilar materials. However, its use is somewhat limited due to high brittleness and insufficient heat resistance. Epoxy potting compound consists of epoxy resin, curing agent, toughening agent, filler, accelerator, coupling agent, and diluent, with the curing agent and epoxy resin being the essential components.

Applications:

Widely used in electronic components, LED lights, lighting, aquarium equipment, handicraft gifts, jewelry, epoxy products, hardware accessories, automotive and motorcycle parts, carbon fiber and fiberglass products, fiber optic products, sporting goods, flooring materials, water and oil filtration products, structural reinforcement and anti-seepage stone treatment, building material repair and bonding, road and bridge construction, ship bonding and corrosion protection, electric power, wind power and thermal power, aviation equipment, and other industries, mainly serving for sealing, protective potting, electrical insulation, moisture-proofing, etc.