HLD-9112 epoxy potting compound

Epoxy Potting Compound

Epoxy potting compound is a high-adhesion adhesive that is very widely used. Huilida's epoxy potting compound is also extensively applied in the aerospace industry. Therefore, it was once known as the “universal adhesive”. Huilida epoxy potting compound features strong adhesive force, high bonding strength, a low shrinkage rate of about 1% upon curing, good medium resistance, excellent electrical performance, convenient application, low toxicity, and suitability for bonding various metallic and non-metallic materials. It bonds both homogeneous and dissimilar materials. However, due to its high brittleness and insufficient heat resistance, it has certain limitations. Epoxy potting compound consists of epoxy resin, curing agent, toughening agent, filler, accelerator, coupling agent, and diluent, with the curing agent and epoxy resin being the essential components.

Applications:

Widely used in electronic components, LEDs, lighting, aquarium equipment, handicraft gifts, jewelry, epoxy products, hardware accessories, automotive and motorcycle parts, carbon fiber and fiberglass products, fiber optic products, sporting goods, flooring materials, water and oil filtration products, structural reinforcement and anti-seepage stone treatment, building material repair and bonding, road and bridge construction, ship bonding and anti-corrosion, electric power, wind power and thermal power, aviation equipment, and other industries, primarily serving the functions of sealing, protective potting, electrical insulation, moisture-proofing, etc.