Keo HUILIDA(汇力达), Thermal conductive silicone adhesive
HLD-DR5008 thermal conductive silicone adhesive Hulida

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Capacity 300 ml
One-component thermal gel is a thermally conductive material with extremely low deformation force and good plasticity, suitable for heat dissipation modules or components with large thickness variations. Its inherent adhesive property eliminates the need for an adhesive layer, and it has good wetting ability, covering extremely small uneven surfaces so that contacting parts can fully contact and improve heat transfer efficiency.



